A critical component
The lead frame carries the silicon die, routes electrical signals and helps transfer heat outside the package.
One. Our New Era.
An integrated lead-frame plant for IC, power discrete and adjacent packages.

A domestic manufacturing platform for a small, essential part of the semiconductor package. The project is planned for Sri City, Tirupathi District, Andhra Pradesh.
The lead frame carries the silicon die, routes electrical signals and helps transfer heat outside the package.
Stamping, etching, plating, trim and form, and quality control brought together in one integrated flow.
Sample development, customer qualification and a staged production ramp underpin the plan. Customer commitments remain a key diligence item.
Lead frames for power electronics, automotive and IC applications. Product images are supplied references; final specifications depend on customer requirements.
From metal strip to a finished lead frame. The detailed pre-plating and post-plating routes are included in the presentation.

Material, plating sequence, delivery format and inspection follow the package and customer specification.
Five-year illustrative projections transcribed from the latest numbered deck. USD million unless stated otherwise.
Illustrative annual ramp; all production assumed sold at a constant average price.
Operating model: 250M units/year; utilisation 75%, 85%, 95%, 100%, 100%. Average selling price $0.0536/unit. Variable cash costs 50% of sales; fixed cash costs $3.752M/year. Depreciation $0.50M/year. Tax 25% of positive profit before tax; no loss carry-forward benefit.
Separate debt scenario: $2M additional debt drawn at FY28 start, 10% interest on opening debt, $0.50M annual principal FY28–FY31. This is separate from the $7M equity ask. Working capital 15% of sales, minimum $1.40M funded at COD. Maintenance CAPEX $0.10M/year. Subsidy receipts excluded.
Interpretation: The illustrative scenario does not establish repayment capacity for financing the entire project with debt. Projections require validated quotations, throughput, yield, customer qualification and a bankable DPR.
Indicative priced equity round.
Seeking a lead investor and co-investors.
Allocations from the supplied pitch deck; indicative and subject to diligence and quotations.
Government of India support: 30% of Capital Expenditure on a pari-passu basis, up to $2.1 million, as stated in the deck. Eligibility, sanction, eligible CAPEX and disbursement terms require confirmation. Excluded from projected cash flows.
Browse the supplied numbered presentation online or download the original PowerPoint. The video slide remains excluded from the viewer, following its hidden status in the deck.

SLN Terminus Building, Gachibowli,
Hyderabad, Telangana, India
Sri City, Tirupathi District,
Andhra Pradesh, India